Intel's upcoming Core Ultra 300-series "Nova Lake-HX" enthusiast mobile processor is set to introduce a new BGA package known as BGA2540. This information was discovered from shipping documents related to prototype boards of the processor. While not socketed, mobile processors typically maintain consistent package sizes and pin configurations across generations to simplify notebook motherboard and cooling system designs for OEMs. In recent years, Intel's enthusiast notebook processors, identified by the "-HX" codename, have featured notebook-friendly BGA versions of the highest-performing "-S" segment silicon, boasting the highest core counts available in the client segment.
Past reports have indicated that the top-tier desktop "Nova Lake-S" processor will see a significant increase in core counts, with a configuration of 16 P-cores, 32 E-cores, and 4 low-power island E-cores, utilizing a 3-tiered hybrid processor design similar to "Meteor Lake." Intel is aiming for base power values of up to 150 W for its leading Core Ultra 9 K-series SKUs. It is highly probable that this silicon will be carried over with a similar core count to the upcoming "Nova Lake-HX," necessitating a larger package for mobile devices. The desktop version of "Nova Lake-HX" will require a motherboard change, as the processor is expected to introduce the new LGA1954 socket.
